Introduction

The trolley-type ceramic sintering furnace features a uniform temperature field, a double-layer heat-resistant furnace body with a surface temperature close to room temperature, and an adjustable heating rate. The furnace chamber is constructed using imported ultra-high-temperature composite fiber material using CNC technology. It offers strong thermal shock resistance, strong resistance to rapid cooling and heating, excellent corrosion resistance, and is non-slumping, crystallization-resistant, and slag-free, pollution-free, and has a long service life. The control system utilizes microcomputer intelligent regulation technology, offering PID control, fully automatic control, self-tuning capabilities, multi-stage programming, and the ability to program various heating, constant temperature, and cooling programs. It offers high temperature control accuracy, high energy efficiency, and high stability. Independent protection devices are provided for overtemperature, overpressure, overcurrent, disconnection, power failure, leakage, and short circuit. The charge table rollers are electrically retractable from the furnace body, facilitating material loading and unloading and improving work efficiency.

Optional Features: Our independently developed control software allows the furnace to be connected to a computer, enabling remote control, furnace start-up and stop, temperature program setting and storage, historical curve viewing and printing, and more.

Application The trolley furnace is a new type of heat treatment equipment widely used in the following areas: 1. Material Sintering: Used for sintering structural ceramics, functional ceramics, electronic ceramics, new ceramics, metal materials, ceramic materials, nanomaterials, new glass materials, and semiconductor materials. 2. Metal Treatment: Used for annealing and tempering high-chromium and high-manganese steel castings, ductile iron, rollers, steel balls, carbon steel, stainless steel, and various mechanical parts. 3. Used for growing and annealing semiconductor materials, as well as encapsulating and sintering electronic components, effectively improving the connection reliability and high-temperature resistance of electronic products.

Specifications - Technical Data